Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method 1st ed.

Author

• Seok, Seonho

Additional Author(s)

-

Publisher

Cham, Switzerland : Springer International Publishing, 2018

Language

English

ISBN

9783319778723

Series

Springer series in advanced manufacturing

Subject(s)

• MACHINERY
• MANUFACTURING INDUSTRIES
• MATERIALS SCIENCE

Notes

. .

Abstract

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Physical Dimension

Number of Page(s)

1 online resource (viii, 115 p.)

Dimension

-

Other Desc.

ill.

Summary / Review / Table of Content

Overview of MEMS packaging technologies --
Adhesion control techniques for debonding --
FEM modeling of debonding --
Polymer cap transfer packaging technologies --
Thin film cap transfer packaging technology --
Other related manufacturing technologies. .

Exemplar(s)

#	Accession No.	Call Number	Location	Status
1.	01134/20	621.381046 Seo A	Online !	Available