Thermal management of microelectronic equipment : heat transfer theory, analysis methods, and design practices

Author

• Yeh, Lian Tuu

Additional Author(s)

• Chu, R.C.

Publisher

New York: The American Society of Mechanical Engineers, 2002

Language

English

ISBN

0791801683

Series

ASME pressbook series on electronic packaging

Subject(s)

• ELECTRONIC APPARATUS AND APPLIANCES-THERMAL PROPERTIES
• HEAT-TRANSMISSION
• ELECTRONIC APPARATUS AND APPLIANCES-COOKING

Notes

• Appendix: p. 349 - 399

Bibliography. Index: p. 405 - 412

Abstract

-

Physical Dimension

Number of Page(s)

xxi, 414 p.

Dimension

24 cm.

Other Desc.

ill.

Summary / Review / Table of Content

No summary / review / table of content available!

Exemplar(s)

#	Accession No.	Call Number	Location	Status
1.	02739/05	- 621.38104 Yeh T	SDF	Available